Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module von K. Otsuka | Ceramic research and development in Japan | ISBN 9781851665792

Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module

Ceramic research and development in Japan

von K. Otsuka
Buchcover Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module | K. Otsuka | EAN 9781851665792 | ISBN 1-85166-579-X | ISBN 978-1-85166-579-2

Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module

Ceramic research and development in Japan

von K. Otsuka
This book is a translation of an important Japanese work on electronic ceramics and includes much experimental data. It will be of great interest to ceramicists and electronic engineers working with ceramic materials interested in an overview of recent Japanese research in this rapidly developing field.