Verlag Springer Singaporeletzte lieferbare Neuerscheinungen: Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology John H. LauSpringer SingaporeeBook2024 Chiplet Design and Heterogeneous Integration Packaging John H. LauSpringer SingaporeSoftcover2024John H. Lau × Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology John H. LauSpringer SingaporeeBook2024 Chiplet Design and Heterogeneous Integration Packaging John H. LauSpringer SingaporeSoftcover2024 Chiplet Design and Heterogeneous Integration Packaging John H. LauSpringer SingaporeHardcover2023 Chiplet Design and Heterogeneous Integration Packaging John H. LauSpringer SingaporeeBook2023 Semiconductor Advanced Packaging John H. LauSpringer SingaporeSoftcover2022 Assembly and Reliability of Lead-Free Solder Joints John H. LauSpringer SingaporeSoftcover2021 Semiconductor Advanced Packaging John H. LauSpringer SingaporeHardcover2021 Semiconductor Advanced Packaging John H. LauSpringer SingaporeeBook2021 Assembly and Reliability of Lead-Free Solder Joints John H. LauSpringer SingaporeHardcover2020 Assembly and Reliability of Lead-Free Solder Joints John H. LauSpringer SingaporeeBook202015 Treffer 1 2